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Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

  • Published:2010-05 Issue:2 Volume:52 Page:248-265
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Er-Ping Li ,Xing-Chang Wei ,Cangellaris Andreas C,En-Xiao Liu ,Yao-Jiang Zhang ,D'Amore Marcello,Joungho Kim ,Sudo Toshio

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

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