A High-Speed EML on Sub-mount for 200G PAM4-Reference-Cited by-同舟云学术

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A High-Speed EML on Sub-mount for 200G PAM4

Published:2022-11 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Photonics Conference (IPC)
language:
Short-container-title:

Author:

Shirao Mizuki¹,Fujita Takuma¹,Uchiyama Asami²,Miura Hiroshi¹,Okuda Shinya²,Ohata Nobuo¹

Affiliation:

1. Information Technology R & D Center Mitsubishi Electric Corporation 5-1-1, Ofuna,Kamakura,Japan

2. High Frequency and Optical Devices Works Mitsubishi Electric Corporation 4-1, Mizuhara, Itami,Hyogo,Japan

Funder

Technology Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9975352/9975444/09975611.pdf?arnumber=9975611

Reference7 articles.

1. Flip-chip interconnection EA-DFB laser module for 100-Gbit/s/λ application

2. Low-chirp isolator-free 65-GHz-bandwidth directly modulated lasers

3. 224-Gb/s PAM4 Uncooled Operation of Lumped-electrode EA-DFB Lasers with 2-km Transmission for 800GbE Application

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 100 Gb/s 超級が期待できる光デバイスの現状性能と課題;Journal of The Japan Institute of Electronics Packaging;2023-05-01

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