Space Charge Redistribution in Epoxy Mold Compounds of High-Voltage ICs at Dry and Wet Conditions: Theory and Experiment-Reference-Cited by-同舟云学术

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Space Charge Redistribution in Epoxy Mold Compounds of High-Voltage ICs at Dry and Wet Conditions: Theory and Experiment

Published:2021-12 Issue:6 Volume:28 Page:2043-2051
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Ahn Woojin¹,Alam Muhammad Ashraful¹,Cornigli Davide²,Reggiani Susanna²,Varghese Dhanoop³,Krishnan Srikanth³

Affiliation:

1. Purdue University,Department of ECE,West Lafayette,IN,USA

2. Advanced Research Center for Electronic Systems “E. De Castro” (ARCES), University of Bologna,Department of Electronics (DEI),Bologna,Italy

3. Texas Instruments Incorporated,Dallas,TX,USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/94/9679679/09679751.pdf?arnumber=9679751

Reference25 articles.

1. An improved model to estimate trapping parameters in polymeric materials and its application on normal and aged low-density polyethylenes

2. On the effect of functionalizer chain length and water content in polyethylene/silica nanocomposites: Part II — Charge transport

3. Elevated-Temperature Space Charge Characteristics and Trapping Mechanism of Cross-Linked Polyethylene Modified by UV-Initiated Grafting MAH

4. The influence of moisture on the electrical properties of crosslinked polyethylene/silica nanocomposites

5. Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation

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1. Charge interaction behaviors at interfacial domains in DC GIL insulators;Applied Physics Letters;2024-04-29

2. Leakage current as a probe into the mechanics of carrier transport in insulating composite polymers;Journal of Applied Physics;2024-04-25

3. Characterization and TCAD Modeling of the Lateral Space Charge Accumulation in Epoxy Molding Compound in Packaged HV-ICs;IEEE Transactions on Electron Devices;2024-04

4. Understanding the role of encapsulation layers under wet conditions on the reliability of power devices;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

5. Anomalous increase of leakage current in epoxy moulding compounds under wet conditions;Solid-State Electronics;2023-10

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