Embedding of Chips for System in Package realization - Technology and Applications-Reference-Cited by-同舟云学术

Embedding of Chips for System in Package realization - Technology and Applications

Published:2008-10 Issue: Volume: Page:
ISSN:
Container-title:2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference
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Author:

Boettcher Lars¹,Manessis Dionysios²,Ostmann Andreas³,Karaszkiewicz Stefan²,Reichl Herbert²

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration (IZM), Gustav-Meyer-Allee 25, 13355 Berlin, Germany, email: lars.boettcher@izm.fraunhofer.de

2. Technical University of Berlin, Gustav-Meyer-Allee 25, 13355 Berlin, Germany

3. Fraunhofer Institute for Reliability and Microintegration (IZM), Gustav-Meyer-Allee 25, 13355 Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4773287/4783791/04783892.pdf?arnumber=4783892

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