Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Acoustic-Emission-Monitored Tests for TAB Inner Lead Bond Quality;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1982-12
2. Bonding Techniques;Microelectronic Packaging;1979