Temperature Impact Analysis and Access Reliability Enhancement for 1T1MTJ STT-RAM-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Temperature Impact Analysis and Access Reliability Enhancement for 1T1MTJ STT-RAM

Published:2016-12 Issue:4 Volume:65 Page:1755-1768
ISSN:0018-9529
Container-title:IEEE Transactions on Reliability
language:
Short-container-title:IEEE Trans. Rel.

Author:

Wu Bi,Cheng Yuanqing,Yang Jianlei,Todri-Sanial Aida,Zhao Weisheng

Funder

China NSFC under

Beijing NSF

EU H2020 CONNECT

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality

Link

http://xplorestaging.ieee.org/ielx7/24/7762242/07585072.pdf?arnumber=7585072

Cited by 40 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A robust deep learning attack immune MRAM-based physical unclonable function;Scientific Reports;2024-09-04

2. Fast response of TMR magnetic sensor in high-frequency alternating magnetic fields under varying temperature conditions;Journal of Magnetism and Magnetic Materials;2024-08

3. A Potential Enabler for High-Performance In-Memory Multi-Bit Arithmetic Schemes With Unipolar Switching SOT-MRAM;IEEE Transactions on Circuits and Systems I: Regular Papers;2024-07

4. Influence of growth temperature on the magnetization dynamics of sputtered CoFeB thin films on various substrates and their microwave device functionality;Journal of Alloys and Compounds;2024-06

5. TEEMO: Temperature Aware Energy Efficient Multi-Retention STT-RAM Cache Architecture;2024 IEEE International Parallel and Distributed Processing Symposium (IPDPS);2024-05-27

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP