Author:
Lim Donghyun,Kim Hojoong,Jang Bongyoung,Cho Honglae,Kim Junyong,Hwang Hasub
Cited by
4 articles.
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1. Impact of warmup wafer surface quality on product wafer defectivity;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01
2. CMP Scratch Improve in Advanced Technology Nodes;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20
3. Tungsten CMP Consumable Localization Study at 28NM Technology Node;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20
4. Advanced Physical Failure Analysis Techniques for Rescuing Damaged Samples with Cracks, Scratches, or Unevenness in Delayering;Advances in Science, Technology and Engineering Systems Journal;2021-07