Author:
Rahangdale Unique,Srinivas Rahul,Krishnamurthy S.,Rajmane Pavan,Misrak Abel,Sakib A. R.,Agonafer Dereje,Lohia Alok,Kummerl Steven,Nguyen Luu T.
Cited by
7 articles.
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1. Reliability Challenges and Mitigation Measures of Small Body-Sized Components on Complex and High-Layer Count PCBs;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Thermal Reliability Study of Si-based Chip Nanosilver Sintered Interconnects;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Investigation of the impact of thermal aging of molding compounds on the solder joint fatigue of a VQFN package;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
4. Investigation of the Factors Affecting the Warpage Prediction of Multi-Chip Package;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
5. An integrated approach to optimize solder joint reliability;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07