Scheduling a Single-Arm Two-Cluster Tool With a Process Module Failure Subject to Wafer Residency Time Constraints
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Published:2023
Issue:
Volume:
Page:1-13
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ISSN:1545-5955
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Container-title:IEEE Transactions on Automation Science and Engineering
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language:
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Short-container-title:IEEE Trans. Automat. Sci. Eng.
Author:
Zhu Qinghua1ORCID,
Yuan Jun1,
Wang Genghong1,
Hou Yan1
Affiliation:
1. School of Computer Science and Technology, Guangdong University of Technology, Guangzhou, China
Funder
National Natural Science Foundation of China
Natural Science Foundation of Guangdong Province, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Control and Systems Engineering