Advanced Investigations of On-board Interconnection Structures using 2D/3D Electromagnetic Field Analysis Methods-Reference-Cited by-同舟云学术

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Advanced Investigations of On-board Interconnection Structures using 2D/3D Electromagnetic Field Analysis Methods

Published:2023-10-18 Issue: Volume: Page:363-368
ISSN:
Container-title:2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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Author:

Petrescu Ştefan¹,Codreanu Norocel²,Vlăduţă Roxana¹,Manolescu Dan¹

Affiliation:

1. Marvell Technologies Romania,Department of CE Package Design,Bucharest,Romania

2. National University of Science and Technology POLITEHNICA,Center for Technological Electronics and Interconnection Techniques Faculty of Electronics, Telecommunications and Information Technology,Department of Electronics Technology and Reliability,Bucharest,Romania

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10430414/10430490/10431178.pdf?arnumber=10431178

Reference6 articles.

1. Signal and power integrity – simplified;Bogatin;Pearson Education Publishing House,2009

2. High frequency common-mode noise in serdes circuits’ optimized interconnections

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