A Scalable Methodology for Designing Efficient Interconnection Network of Chiplets
Author:
Affiliation:
1. Tsinghua University,Institute for Interdisciplinary Information Sciences (IIIS),Beijing,China
2. Tsinghua University,School of Software,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10070856/10070923/10070981.pdf?arnumber=10070981
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