Cost-Effective Prognostics of IGBT Bond Wires With Consideration of Temperature Swing
Author:
Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9037388/08933142.pdf?arnumber=8933142
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1. Enhancing qualification via the use of diagnostics and prognostics techniques;Quality and Reliability Engineering International;2024-08-05
2. Parameter Correction Method of Vce(on)-Based Junction Temperature Estimation Model Based on Bonding Wire Fatigue;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08
3. A Detection Method for Local Wire Bond Failure in IGBT Based on High-Frequency Time-Domain Reflective Signal Response Analysis;2024 IEEE 2nd International Conference on Power Science and Technology (ICPST);2024-05-09
4. gEOL: A Gradient-Based End-of-Life Criterion for Power Semiconductor Modules;IEEE Transactions on Power Electronics;2024-03
5. Impact of Bond Wire Degradation on Thermal Estimation and Temperature Coefficient of IGBT Modules in Power Cycling Test;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25
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