Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages-Reference-Cited by-同舟云学术

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Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)
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Author:

Occhionero M.A.,Hay R.A.,Adams R.W.,Fennessy K.P.

Publisher

IMAPS - Int. Microelectron. & Packaging Soc

Link

http://xplorestaging.ieee.org/ielx4/6129/16387/00757298.pdf?arnumber=757298

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tunable thermal expansion in zinc-bonded composites: Zn/Si/Zn0.75Sn0.2Mn0.05NMn3;Scripta Materialia;2020-03

2. Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges;Advanced Materials Research;2011-10

3. Al–SiC ELECTRONIC PACKAGES WITH CONTROLLED THERMAL EXPANSION COEFFICIENT BY A NEW METHOD OF PRESSURELESS INFILTRATION;Materials and Manufacturing Processes;2001-06-30

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