Recent advances in SAW packaging-Reference-Cited by-同舟云学术

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Recent advances in SAW packaging

Published: Issue: Volume: Page:
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Container-title:2001 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.01CH37263)
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Author:

Selmeier P.,Grunwald R.,Przadka A.,Kruger H.,Feiertag G.,Ruppel C.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7781/21383/00991627.pdf?arnumber=991627

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02

2. SAW Cavity Sealing using Dielectric film in Wafer-level packaging;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

3. A Multilayered Structure for Packageless Acoustic- Wave Devices With Ultra-Small Sizes;Journal of Microelectromechanical Systems;2021-08

4. The 2019 surface acoustic waves roadmap;Journal of Physics D: Applied Physics;2019-07-03

5. Microwave Acoustic Wave Devices: Recent Advances on Architectures, Modeling, Materials, and Packaging;IEEE Transactions on Microwave Theory and Techniques;2018-10

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