Artificial Neural Networks and Bayesian Techniques for Flip-Chip Package Thermo-Mechanical Analysis-Reference-Cited by-同舟云学术

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Artificial Neural Networks and Bayesian Techniques for Flip-Chip Package Thermo-Mechanical Analysis

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Sinha Tuhin,Sikka Kamal,Lall Rahul

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501583.pdf?arnumber=9501583

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Finite element based Model Order Reduction for parametrized one-way coupled steady state linear thermo-mechanical problems;Finite Elements in Analysis and Design;2022-12

3. A comparison of artificial intelligence models for predicting phosphate removal efficiency from wastewater using the electrocoagulation process;Digital Chemical Engineering;2022-09

4. Layered Unsupervised Learning-based Identification and Quantification of Voids in Package Thermal Interface Materials;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

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