Author:
Xu Guoliang,Sun Chao,Ding Jiaqi,Liu Sheng,Kuang Ziliang,Liu Li,Chen Zhiwen
Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Natural Science Foundation of Hubei Province
Hubei Provincial Natural Science Foundation of China
Hubei Provincial Major Program of Technological Innovation
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
2. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Interface StressAnalysis Based on Warpage Characterization in a Flip-Chip Package;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10