Author:
Ochmann Maximilian,Leslie David,Meier Karsten,Dasgupta Abhijit,Bock Karlheinz
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Copper Trace Failures in Ball Grid Array (BGA) Packages under Sequential Harmonic Vibration and Temperature Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
2. Durability of Copper Traces in Ball Grid Array (BGA) Assemblies under Sequential Harmonic Vibration and Temperature Cycling;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25