Author:
Sitta Alessandro,Russo Sebastiano,Torrisi Marco,Messina Angelo Alberto,D'Arrigo Giuseppe,Sequenzia Gaetano,Renna Marco,Calabretta Michele
Cited by
11 articles.
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1. Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module Under Several Operating Condition;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
4. Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications;2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE);2023-07-17
5. Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications;Journal of Electronic Packaging;2022-12-23