1. Analysis on the development of semiconductor manufacturing process
2. 450 mm Silicon: An Opportunity and Wafer Scaling
3. Improvements in Thin Wafer Handling - Equipment and Material Impacts;Hladik
4. SEMI 3D4 - Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks;SEMI,2022
5. Analysis of Handling Stresses and Breakage of Thin Crystalline Silicon Wafers;Brun;Georgia Institute of Technology, Atlanta, Georgia, USA,2008