Integration of passive and active components into build-up layers-Reference-Cited by-同舟云学术

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Integration of passive and active components into build-up layers

Published:2002 Issue: Volume: Page:
ISSN:
Container-title:4th Electronics Packaging Technology Conference, 2002.
language:
Short-container-title:

Author:

Ostmann A.¹,Neumann A.,Auersperg J.,Ghahremani C.,Sommer G.,Aschenbrenner R.,Reichl H.

Affiliation:

1. Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/8446/26603/01185672.pdf?arnumber=1185672

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