3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applications-Reference-Cited by-同舟云学术

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3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applications

Published:2009-12 Issue: Volume: Page:
ISSN:
Container-title:2009 11th Electronics Packaging Technology Conference
language:
Short-container-title:

Author:

Yoon Seung Wook,Bahr A.,Baraton X.,Marimuthu Pandi Chelvam,Carson Flynn

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5398729/5416395/05416412.pdf?arnumber=5416412

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Warpage Suppression during FO-WLP Fabrication Process;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

3. Advances in the Fabrication Processes and Applications of Wafer Level Packaging;Journal of Electronic Packaging;2014-04-29

4. Development of a mid range automotive radar sensor for future driver assistance systems;International Journal of Microwave and Wireless Technologies;2013-01-24

5. A 79 GHz SiGe short-range radar sensor for automotive applications;International Journal of Microwave and Wireless Technologies;2013-01-04

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