Novel Approaches to Current BGA Packaging Challenges-Reference-Cited by-同舟云学术

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Novel Approaches to Current BGA Packaging Challenges

Published:2008-12 Issue: Volume: Page:
ISSN:
Container-title:2008 10th Electronics Packaging Technology Conference
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Author:

Ryu ChangGyun,Hsu Jackson,Mendoza Lito,Capuz Au,Caguiat Jaycie,Sy Hansen,Lathrop Rick

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4753888/4763398/04763603.pdf?arnumber=4763603

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology;Journal of Materials Research and Technology;2024-01

2. Coupling Effect of Electromigration and Joule Heating Induced Failure in Advanced Packaging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging;Chips;2022-11-17

4. Solder Ball Attach With Water Soluble Air Reflowable Tacky Fluxes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-05

5. Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing;Journal of Electronic Materials;2014-06-10

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