Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints-Reference-Cited by-同舟云学术

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Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
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Author:

Che F.X.,Pang J.H.L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9607/30353/01396715.pdf?arnumber=1396715

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test;Soldering & Surface Mount Technology;2024-04-15

2. Physics-driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages;Journal of Electronic Packaging;2021-08-06

4. Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling;2019 IEEE 21st Electronics Packaging Technology Conference (EPTC);2019-12

5. Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging;Journal of Electronic Packaging;2018-03-01

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