Numerical simulation of the drop impact response of a portable electronic product-Reference-Cited by-同舟云学术

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Numerical simulation of the drop impact response of a portable electronic product

Published:2002-09 Issue:3 Volume:25 Page:478-485
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:en
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Chwee-Teck Lim ,Teo Y.M.,Shim V.P.W.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/25974/01159185.pdf?arnumber=1159185

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