Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications-Reference-Cited by-同舟云学术

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Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications

Published:2010-02 Issue:1 Volume:33 Page:30-36
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Li-Han Hsu ,Wei-Cheng Wu ,Chang E.Y.,Zirath H.,Yun-Chi Wu ,Chin-Te Wang ,Ching-Ting Lee

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/5423263/05345704.pdf?arnumber=5345704

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-09

2. Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to $V$-Band Frequencies With Excellent Reliability;IEEE Transactions on Microwave Theory and Techniques;2010-08

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