Location of Oxide Breakdown Events under Off-state TDDB in 28nm N-MOSFETs dedicated to RF applications
Author:
Affiliation:
1. STMicroelectronics,Crolles,France,38920
2. ISEN Yncréa Méditerranée, REER-IM2NP UMR CNRS 7334,Toulon,France,83000
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10117589/10117581/10117725.pdf?arnumber=10117725
Reference30 articles.
1. Hot-Carrier degradation in P- and N-channel EDMOS for smart power application
2. Hot-Carrier induced Breakdown events from Off to On mode in NEDMOS
3. Off-state mode TDDB reliability for ultra-thin gate oxides: New methodology and the impact of oxide thickness scaling
4. Voltage-Splitting Technique for Reliability Evaluation of Off-State Mode of MOSFETs in Ultrathin Gate Oxides
5. Multi-probe Two-Dimensional Mapping of Off-State Degradation in DeNMOS Transistors: How and Why Interface Damage Predicts Gate Dielectric Breakdown
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Universal Dielectric Breakdown Modeling Under Off-State TDDB for Ultra-Scaled Device From 130nm to 28nm Nodes and Beyond;IEEE Transactions on Device and Materials Reliability;2024-06
2. Current Driven Modeling and SILC Investigation of Oxide Breakdown under Off-state TDDB in 28nm dedicated to RF applications;2023 IEEE International Integrated Reliability Workshop (IIRW);2023-10-08
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