3D Stacking Process Technologies for Advanced CMOS Image Sensors

Author:

Kagawa Yoshihisa1,Manda Shuji1,Ikegami Yukako1,Kamei Takahiro1,Shimizu Kan1,Iwamoto Hayato1

Affiliation:

1. Sony Semiconductor Solutions Corporation,Kanagawa,Japan

Funder

New Energy and Industrial Technology Development Organization

Publisher

IEEE

Reference10 articles.

1. A 1/4-inch 8Mpixel back-illuminated stacked CMOS image sensor

2. 3D Stacked CMOS Image Sensor Exmor RSTM;Umebayashi;ISSCC,2014

3. Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

4. A Back-Illuminated Global-Shutter CMOS Image Sensor with Pixel-Parallel 14b Subthreshold ADC;Sakakibara;ISSCC,2018

5. High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer;IEDM,2019

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