Advancing Efficiency in Thermal Simulation Algorithms for Chip Packaging-Reference-Cited by-同舟云学术

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Advancing Efficiency in Thermal Simulation Algorithms for Chip Packaging

Published:2023-07-21 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 6th International Conference on Electronic Information and Communication Technology (ICEICT)
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Author:

Zhang Wenkai¹,Niu Kaikun¹,Li Yingsong²,Huang Zhixiang²,Ren Xingang²,Wu Xianliang²

Affiliation:

1. Anhui University, Anhui Coreach Technology Co.,Ltd,Anhui Province Key Laboratory of Target Recognition and Feature Extraction,Anhui Province,China

2. Anhui University,Information Materials and Intelligent Sensing Laboratory of Anhui Province,Anhui Province,China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Anhui Province

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10244769/10244774/10245598.pdf?arnumber=10245598

Reference8 articles.

1. A Hybridizable Discontinuous Galerkin Time-Domain Method With Robin Transmission Condition for Transient Thermal Analysis of 3-D Integrated Circuits

2. 3-D Thermal-ADI: a linear-time chip level transient thermal simulator

3. Stability Analyses of Nonuniform Time-Step LOD-FDTD Methods for Electromagnetic and Thermal Simulations

4. Coupled Electro-Thermal Transient Analysis of Superconducting DC Transmission Systems Using FDTD and VEM Modeling

5. Thermal-ADI - a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method

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