Adhesion improvement of Thick Printed Copper film on alumina substrates by controlling of oxygen level in furnace
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7553393/7562869/07563154.pdf?arnumber=7563154
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5. Effect of copper- and silver-based films on alumina substrate electrical properties;Ceramics International;2018-02
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