Hybrid Integration of Polymer PICs and InP Optoelectronics for WDM and SDM Terabit Intra-DC Optical Interconnects

Author:

Andrianopoulos Efstathios1ORCID,Pagano Annachiara2ORCID,Groumas Panos3ORCID,Piat Anna Chiadó2,de Felipe David4,Troppenz Ute5,Weigel Madeleine4,Kresse Martin4,Theurer Michael5,Kouloumentas Christos3,Tsokos Christos1,Tegegne Zerihun6,Bakopoulos Paraskevas7,Moehrle Martin4,Massaouti Maria1,Megas Giorgos1,Runge Patrick8,Keil Norbert5,Avramopoulos Hercules1

Affiliation:

1. School of Electrical and Computer Engineering, National Technical University of Athens,Athens,Greece

2. Transport and Access Innovation Telecom Italia,Torino,Italy

3. Optagon Photonics,Athens,Greece

4. Hybrid PICs Fraunhofer HHI,Berlin,Germany

5. Laser group Fraunhofer HHI,Berlin,Germany

6. Photonics Assembly PHIX,Enschede,The Netherlands

7. NVIDIA Ermou 56,Athens,10563

8. Modulators and Detectors group Fraunhofer HHI,Berlin,Germany

Publisher

IEEE

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