Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure-Reference-Cited by-同舟云学术

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Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure

Published:2024-05-28 Issue: Volume: Page:1896-1899
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Hsiung Chien-Kang¹,Wang Terry²,Wozny Sarah³,Bernt Marvin L³,Chen Kuan-Nang⁴

Affiliation:

1. Applied Material Inc/National Yang Ming Chiao Tung University (NYCU),Hsinchu,Taiwan

2. Industrial Technology Research Institute (ITRI),Hsinchu,Taiwan

3. Applied Material Inc,Santa Clara,US

4. National Yang Ming Chiao Tung University (NYCU),Hsinchu,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565024.pdf?arnumber=10565024

Reference7 articles.

1. Integrated Fan‐Out (InFO) for High Performance Computing

2. Organic Interposer CoWoS-R⁺ (plus) Technology

3. Warpage Investigation of Fan-Out Wafer-Level Packaging With Novel Thermosetting Films

4. 2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages

5. A hybrid bonding interconnection with a novel low-temperature bonding polymer system

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