Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging-Reference-Cited by-同舟云学术

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Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging

Published:2024-05-28 Issue: Volume: Page:1416-1423
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Libsch Frank¹,Bedell Steve¹,Cabral Cyril¹,Paidimarri Arun¹,Subramarian Chitra¹,Munetoh Seiji²

Affiliation:

1. IBM Research,Yorktown Heights,NY,USA

2. IBM Research,Kawasaki,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564944.pdf?arnumber=10564944

Reference16 articles.

1. Crypto anchors

2. Ultra-low-power sub-photon-voltage high-efficiency light-emitting diodes

3. Dust‐Sized High‐Power‐Density Photovoltaic Cells on Si and SOI Substrates for Wafer‐Level‐Packaged Small Edge Computers

4. Issues and Solutions for On-chip Antenna Designs in High Resistivity Silicon

5. Module, antenna, and package design considerations for mm-scale IoT devices

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