High RF-high power dual capacitively coupled plasma characteristics dependency on process parameters: a finite element analysis approach-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

High RF-high power dual capacitively coupled plasma characteristics dependency on process parameters: a finite element analysis approach

Published:2024-05-28 Issue: Volume: Page:2112-2116
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Khan Md Ishak¹,Hu Xiyu¹,Wei Wei¹,Chen Haobo¹,Haehn Nicholas²,Guo Xiaoying¹,Arana Leonel¹,Akazawa Kensuke³

Affiliation:

1. Intel Corporation,Substrate Packaging Technology Development,Chandler,Arizona,USA

2. Intel Corporation,Core Competency,Chandler,Arizona,USA

3. ULVAC Inc.,Kanagawa,Japan

Funder

Intel Corporation

Lam Research

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564940.pdf?arnumber=10564940

Reference13 articles.

1. The impact of frequency mixing on sheath properties: Ion energy distribution and Vdc∕Vrf interaction

2. Simulation of Capacitively Coupled Single- and Dual-Frequency RF Discharges

3. Numerical investigation of ion-energy-distribution functions in single and dual frequency capacitively coupled plasma reactors

4. VizGrain: a new computational tool for particle simulations of reactive plasma discharges and rarefied flow physics

5. PLAZMARK plasma dots to visualize plasma process

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP