A Study on Novel Low Temperature Soldering Process using Vapor phase-Reference-Cited by-同舟云学术

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A Study on Novel Low Temperature Soldering Process using Vapor phase

Published:2024-05-28 Issue: Volume:2017 Page:2091-2095
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Kim Youngja¹,Choi Woojin²,Oh Seungyeop²,Lee Sinyeop³,Kang Sunwon⁴

Affiliation:

1. Samsung Electronics Co., Ltd.,AVP Process Development Team,Cheon-An Si,South Korea

2. Samsung Electronics Co., Ltd,Package Process Development Team,Asan Si,South Korea

3. Samsung Electronics Co., Ltd,Package Engineering Team,Asan Si,South Korea

4. Samsung Electronics Co., Ltd,Package Development,Asan Si,South Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565107.pdf?arnumber=10565107

Reference10 articles.

1. Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability

2. DRAM variable retention time

3. AVATAR: A Variable-Retention-Time (VRT) Aware Refresh for DRAM Systems

4. The origin of variable retention time in DRAM

5. Low temperature soldering using Sn-Bi alloys;Ribas

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