A Robust Integrated Power Delivery Methodology for 3-D ICs-Reference-Cited by-同舟云学术

A Robust Integrated Power Delivery Methodology for 3-D ICs

Published:2023-03 Issue:3 Volume:31 Page:287-295
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Safari Yousef¹^ORCID,Vaisband Boris¹^ORCID

Affiliation:

1. Electrical and Computer Engineering Department, Heterogeneous Integration Knowledge (THInK) Team, McGill University, Montreal, QC, Canada

Funder

Natural Sciences and Engineering Research Council of Canada

Fonds de Recherche du Québec—Nature et Technologies

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/92/10049803/09930792.pdf?arnumber=9930792

Reference36 articles.

1. A 500 MHz, 68% efficient, fully on-die digitally controlled buck Voltage Regulator on 22nm Tri-Gate CMOS

2. Fivr—Fully integrated voltage regulators on 4th generation Intel core SoCs;burton;Proc IEEE Appl Power Electron Conf Expo,2014

3. 3-D ICS as a platform for heterogeneous systems integration;vaisband,2017

4. A digitally controlled fully integrated voltage regulator with 3D-TSV based on-die solenoid inductor with backside planar magnetic core in 14 nm tri-gate CMOS;krishnamurthy;Proc IEEE Symp VLSI Technol,2017

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