登录 注册 会员服务 联系我们

Dynamic Built-In Redundancy Analysis for Memory Repair

  • Published:2019-10 Issue:10 Volume:27 Page:2365-2374
  • ISSN:1063-8210
  • Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • language:
  • Short-container-title:IEEE Trans. VLSI Syst.

Author:

Lee HayoungORCID,Han Donghyun,Lee Seungtaek,Kang SunghoORCID

Funder

Ministry of Trade, Industry and Energy

KSRC (Korea Semiconductor Research Consortium) support program for the development of the future semiconductor device

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. GRAP: Efficient GPU-Based Redundancy Analysis Using Parallel Evaluation for Cross Faults;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-08

2. Efficient Built in Self Repair for Multiple RAMs;2023 IEEE 8th International Conference for Convergence in Technology (I2CT);2023-04-07

3. VLSI implementation of low-power and area efficient parallel memory allocation with EC-TCAM;Integration;2022-11

4. Deep Q-Learning with Bit-Swapping-Based Linear Feedback Shift Register fostered Built-In Self-Test and Built-In Self-Repair for SRAM;Micromachines;2022-06-19

5. ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2022-06
同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3