A Fully Coupled Model of Multi-Chip Press-Pack IGBT for Thermo-Mechanical Stress Distribution Prediction-Reference-Cited by-同舟云学术

A Fully Coupled Model of Multi-Chip Press-Pack IGBT for Thermo-Mechanical Stress Distribution Prediction

Author:

Zhan Cao¹^ORCID,Zhu Lingyu¹^ORCID,Zhang Yaxin¹,Dai Jiangang¹,Hou Ting²,Song Ying³^ORCID,Ji Shengchang¹^ORCID,Iannuzzo Francesco⁴^ORCID

Affiliation:

1. State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, China

2. State Key Laboratory of HVDC Transmission Technology, China Southern Power Grid, Electric Power Research Institute, Guangzhou, China

3. College of Water Resources and Architectural Engineering, Northwest A&F University, Yangling, China

4. Department of Energy Technology, Aalborg University, Aalborg, Denmark

Funder

State Key Laboratory of HVDC Transmission Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering

Link

Reference25 articles.

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