High Strength die Attaching Structure Fabricated via in Situ Reduction-Sintering of Micron Copper Paste
Author:
Affiliation:
1. Heraeus Materials Technology Shanghai Ltd,Shanghai,China
2. School of Material Science and Chemical Engineering, Harbin University of Science and Technology,Harbin,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10399638/10399484/10399716.pdf?arnumber=10399716
Reference10 articles.
1. High-temperature electronics - a role for wide bandgap semiconductors?
2. Mechanical properties of nano-silver joints as die attach materials
3. Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating
4. Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
5. Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects
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