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An Improved Multiple Scattering Method for Via Structures With Axially Isotropic Modes in an Irregular Plate Pair

  • Published:2012-04 Issue:2 Volume:54 Page:457-465
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Zhang Yao-Jiang,Chada Arun Reddy,Fan Jun

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

2. Design and Analysis of Broadband Power Delivery Network Noise Absorber for Parallel-Plate Mode Suppression;IEEE Transactions on Microwave Theory and Techniques;2023-04

3. Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz;IEEE Transactions on Signal and Power Integrity;2023

4. Accurate Field-Circuit Hybrid Modeling of High-Density Through Glass Via Arrays by Using Perfect Magnetic Conductors and Cylindrical Mode Expansion;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-01

5. A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair;IEEE Transactions on Electromagnetic Compatibility;2015-08
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