Author:
Mulvaney B.J.,Richardson W.B.,Crandle T.L.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
53 articles.
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2. Thermal-Annealing Effects on Dopant Redistribution in Nanoscale Si Fin;Japanese Journal of Applied Physics;2011-07-20
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4. Dopant Diffusion;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09
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