Research on Influencing Factors of Chip Dynamic Current Distribution in IGBT Module-Reference-Cited by-同舟云学术

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Research on Influencing Factors of Chip Dynamic Current Distribution in IGBT Module

Published:2023-11-28 Issue: Volume:40 Page:1-6
ISSN:
Container-title:2023 IEEE Sustainable Power and Energy Conference (iSPEC)
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Author:

Meiting Cui¹,Zhongyuan Chen¹,Hongji Li¹

Affiliation:

1. Beijing Institute of Smart Energy, Chang Ping District,Beijing,102209

Funder

Science and Technology Project of State Grid

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10402601/10402797/10403073.pdf?arnumber=10403073

Reference10 articles.

1. IGBT modules: Technologies, driver and application, Han Jingang translated;Volke,2016

2. Review on Topology and Industry Applications of Modular Multilevel Converter;Xiaofeng;Power system technology,2016

3. Measurement of multiple chip current in a Press-Pack IGBT using Rogowski coils;Bock

4. Optimization of the current distribution in press-pack high power IGBT modules

5. Evaluation on Current Sharing of Power Module Affected by Kelvin Connection;Zheng

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