Analysis of the Grinding Characteristics of β-Ga2O3 Crystal on Different Planes

Abstract

The (010) and (100) planes of a [Formula: see text]-Ga2O3 crystal were subjected to precision grinding tests with a resin bond diamond grinding wheel on a precision surface grinding machine. The grinding characteristics and surface grinding quality of the planes of the [Formula: see text]-Ga2O3 crystal were analyzed on the basis of grinding force, grinding force ratio, specific energy, and surface morphology. The (010) plane shows a larger grinding force and specific energy but a smaller grinding force ratio compared with the (100) plane. Under experimental conditions, the normal and tangential grinding forces of the (010) plane are 1.4–2.2 and 2.6–7.8 times that of the (100) plane, respectively. The specific energy of the (010) plane is 2.8–6.1 times that of the (100) plane, and the grinding force ratio of the (100) plane is 1.4–3.7 times that of the (010) plane. Under the same grinding conditions, the material removal methods for the two planes are evidently different. The (010) plane is mainly removed by brittle fracture and accompanied by a minimal broken area, whereas the (100) plane is mainly removed by cleavage layering and exhibits numerous block cleavage. The (100) plane is the strong cleavage surface, and the (100) plane demonstrates a higher surface roughness than the (010) plane under the same grinding conditions.