Abstract
Hard coatings like Titanium diboride (TiB2) on silicon substrates which are used for interconnects. micro-electro-mechanical devices and metallurgical protective coatings were analyzed based on shallow depths of nanoindentation penetration. The change in the nature of the contact from Hertzian to Pyramidal both in loading as well as unloading modes were examined. Features like ductile fracture, linear unloading, and the creation of electrical conduction paths were analyzed. These high-precision features are influenced by the thickness and crystalline nature of the films and are significant for device fabrication.