Proposal of Damage-Free SiC Wafer Dicing Using Water Jet Guided Laser-Reference-Cited by-同舟云学术

Proposal of Damage-Free SiC Wafer Dicing Using Water Jet Guided Laser

Published:2024-08-21 Issue: Volume:1124 Page:85-89
ISSN:1662-9752
Container-title:Materials Science Forum
language:
Short-container-title:MSF

Author:

Kadoya Shotaro¹,Takahashi Satoru¹,Michihata Masaki¹,Ohtani Noboru²,Abe Kozo²,Arimura Shunsuke³

Affiliation:

1. The University of Tokyo

2. Kwansei Gakuin University

3. MAKINO Milling Machine Co., Ltd.

Abstract

A damage-free SiC wafer dicing method has been strongly required for practical applications of power devices. In this research, we propose water jet guided laser processing as a novel dicing method. Water jet guided laser processing, which uses a high-pressure fine water jet as waveguide, could generate no cracks or dislocations in crystal. In this paper, water jet guided laser grooving quality was evaluated to demonstrate there should be no chippings and basal plane dislocations. Scanning electron microscopic and X-ray topography observations were conducted. The results indicated the superiority of water jet guided laser dicing to a conventional dicing method.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/MSF.1124.85.pdf

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