Affiliation:
1. Canon-ANELVEA Engineering
2. Canon ANELVA CORPORATION
3. Sukegawa Electric, Ltd.
4. Hosei University
Abstract
We develop the rapid thermal anneal system of the implanted SiC, Electron Bombardment Anneal System (EBAS), which is able to heat up to 1900 oC with a rate of 320 oC/min in vacuum. Using this novel system, the annealing of N+ implanted SiC samples (total dose: 2.4 x 1015 cm-2, thickness: 220 nm) at 1900 oC for 0.5 min results in a low sheet resistance of 1.39 x 103 ohm/sq. with extremely low roughness of the surface (RMS value: 0.32 nm). It is also demonstrated that EBAS can anneal the sample with low electric power consumption.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
1. M. Bhatnagar and B. J. Baliga: IEEE Trans. Electron Devices Vol. 40 (1993), p.645.
2. G. L. Harris, Silicon Carbide, ed. G. L. Harris (INSPEC, London, 1995) EMIS Datareviews Series No. C, Chap 7.
3. T. Kimoto, N. Inoue and H. Matsunami: Phys. Stat. Sol. (a) Vol. 162 (1997), p.263.
4. T. Troffer, M. Schadt, T. Frank, H. Itoh, G. Pensl, J. Heidl, H. P. Strunk and M. Maier: Phys. Stat. Sol. (a) Vol. 162 (1997), p.277.
5. M. A. Capano, S. Ryu, M. R. Melloch, J. A. Cooper, JR., and M. R. Buss: J. Electron. Mater. Vol. 27 (1998), p.370.
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献