New Material of Ni-Ti Alloy for Chip Tantalum Capacitor Fuse-Reference-Cited by-同舟云学术

New Material of Ni-Ti Alloy for Chip Tantalum Capacitor Fuse

Published:2005-01 Issue: Volume:475-479 Page:1767-1770
ISSN:1662-9752
Container-title:Materials Science Forum
language:
Short-container-title:MSF

Author:

Liu Yang¹,Wang Yan¹,Ma Ju Sheng¹

Affiliation:

1. Tsinghua University

Abstract

With the wide application of SMT, mass chip components have been applied including tantalum capacitor. A fuse buried in a capacitor can protect the whole system of merit. In the paper a titanium nickel alloy with vanadium addition has been developed as a fuse material. Several alloy wires with different diameters have been used in the fusing experiment. The influencing factor have been discussed that a few factors including diameter, chucking and so on affect the fusing current. Analyses on the fuse wires have been investigated with SEM, XRF and XRD to measure the composition of alloy wires.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.scientific.net/MSF.475-479.1767.pdf

Reference8 articles.

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2. T IC. Tantalum consumption. T IC Bulletin Vol. 12 (1997), p.5～6.

3. Yu Lingyu: Research and Technology Status of Chip Tantalum Capacitance. Electronic Productions Vol. 2 (1996).

4. Li Huan: KEMET's Series of Solid Tantalum Capacitance. Audio Engineering Vol. 10 (2000).

5. Xu Zuyao: Shape Memory Materials (2000), pp.1-2, p.18.

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