Development of Large Diameter High-Purity Semi-Insulating 4H-SiC Wafers for Microwave Devices
Author:
Affiliation:
1. Cree Incorporation
2. Cree Research, Inc.
3. Cree, Incorporation
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.scientific.net/MSF.457-460.35.pdf
Reference15 articles.
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