Dip Degreasing Stage Improvement in Car Body Pretreatment Process by Six Sigma

Author:

Palrungsri Jadesupa1,Chutima Parames1

Affiliation:

1. Chulalongkorn University

Abstract

An automobile company in this research faced the consistency problem from the chemical concentration in degreasing bath which was one of the stages in the pretreatment process. The problem came from the proportion of total alkaline (T.Al) lower than the lower control limit (LCL) which was set at 18.2 points during February – May 2020. This resulted in the low values of Cp and Cpk, i.e. 0.83 and 0.51, respectively. To remedy the problem, Six Sigma (DMAIC) was applied to improve the process stability. The cause and effect matrix was used to analyse the potential causes of problems and prioritise the causes to solve. It was found that four (causes) factors were solved by auto titration and feeding controller installation to reduce variance and increase stability. Another one factor, quality of water, was improved by adding a check item to monitor and collect data during the initial implementation stage. The result after improvement showed that Cp and Cpk were increased to 1.82 and 1.52 in August 2020, respectively.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference9 articles.

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Application of Computerized Six Sigma Approach to Minimize Dewetting defects in a printed circuit board assembly process;2024 6th International Conference on Management Science and Industrial Engineering;2024-04-24

2. Improving Hitting Effect Between Grip and Base of Assist Grip in Trucks by The Six Sigma Approach;2022 4th International Conference on Management Science and Industrial Engineering (MSIE);2022-04-28

3. Die and Punch Wear Reduction in Stamping Process by Lean Six Sigma Approach;Materials Science Forum;2022-04-05

4. Core slide defect reduction of PVC tape by Six Sigma approach;2021 4th International Conference on Electronics and Electrical Engineering Technology;2021-12-03

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