Heat Slug Material Variation Analysis on Thermal Dissipation of High Power LED

Abstract

Accession of power in high power LED light source has resulted in thermal issue which causes reliability malfunction due to deficient heat dissipation. However, the heat disspation of high power LED can be enhance by improving packaging material selection.Thus, in this work, the connotation of heat slug material on the thermal performance of high power LED package was analyzed through simulation method. The significance of two heat slug materials, copper (Cu) and copper diamond (CuDia) were evaluated in terms of junction temperature, von Mises stress and thermal resistance. The simulation was executed using Ansys version 11 at ambient temperature of 25 °C with natural convection condition.