Cure Kinetics of High Performance Epoxy Molding Compounds

Abstract

The reaction of EMCs with the triphenylphosphine-1,4-benzoquinone (TPP-BQ) latent catalyst also had a higher temperature sensitivity compared to the reaction of EMCs with triphenylphosphine (TPP) catalyst. In resin transfer molding, EMCs containing the TPP-BQ thermal latency accelerator are least active at a low temperature. Consequently, EMCs have a low melt viscosity before gelation, and the resins and filler are evenly mixed in the kneading process. Additionally, the rheological property, flowability, is increased before the EMC form a network structure in the molding process. The proposed kinetic model adequately describes curing behavior in EMCs cured with two different organophosphine catalysts up to the rubber state in the progress of curing.